About: How to identify chip packages/Non-standard   Sponge Permalink

An Entity of Type : owl:Thing, within Data Space : 134.155.108.49:8890 associated with source dataset(s)

Sometimes called 3D | STACKED DIE | PACKAGE-on-PACKAGE (PoP) * PSvfBGA: Package Stackable Very Thin Fine Pitch BGA (Amkor) * MCP, Stacked-Die Leadframe Packages: Multi-Chip package, Stacked-Die Leadframe Packages. This not a chip carrier but a way to stack die in a chip carrier (Amkor) * S-CSP: Stacked CSP

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rdfs:label
  • How to identify chip packages/Non-standard
rdfs:comment
  • Sometimes called 3D | STACKED DIE | PACKAGE-on-PACKAGE (PoP) * PSvfBGA: Package Stackable Very Thin Fine Pitch BGA (Amkor) * MCP, Stacked-Die Leadframe Packages: Multi-Chip package, Stacked-Die Leadframe Packages. This not a chip carrier but a way to stack die in a chip carrier (Amkor) * S-CSP: Stacked CSP
dcterms:subject
abstract
  • Sometimes called 3D | STACKED DIE | PACKAGE-on-PACKAGE (PoP) * PSvfBGA: Package Stackable Very Thin Fine Pitch BGA (Amkor) * MCP, Stacked-Die Leadframe Packages: Multi-Chip package, Stacked-Die Leadframe Packages. This not a chip carrier but a way to stack die in a chip carrier (Amkor) * S-CSP: Stacked CSP
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