IPDIA activity is based on an innovative technology called PICS (Passive Integration Connecting Substrate). The PICS technology developed by IPDiA R&D team uses the thickness of the silicon to integrate tens to even hundreds of passive components. The figure on the right shows a sectional view of PICS capacitors: Benefits of PICS technology: * Miniaturization * Reliability * Cost reduction IPDiA offers a wide product range: 3D silicon capacitors, integrated passive components on silicon, ESD protection devices for HB LEDs. Visit IPDiA website :